Vertiv to provide Intel chip cooling
Vertiv, a global provider of digital infrastructure and continuity solutions, today announced a new collaboration with tech giant Intel to develop a liquid cooling solution for the upcoming Intel Gaudi3 AI accelerator.
The solution, scheduled for launch in 2024, addresses the growing demand for eco-friendly cooling options in the face of rising heat levels generated by AI computing and associated applications.
In a statement, Vertiv said the system will be compatible with both liquid- and air-cooled servers, utilizing Vertiv's P2P (pumped two-phase) infrastructure.
Initial testing demonstrated the system's ability to handle heat loads as high as 160 kW.
Water with a starting temperature of 17 degrees Celsius (62.6 Fahrenheit) was used to cool the system, reaching a maximum temperature of 45 degrees Celsius (113 degrees Fahrenheit).
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Air-cooled solutions were also tested and successfully managed heat loads of up to 40 degrees Celsius. This flexibility allows customers to implement various cooling strategies, including free air cooling, warm water cooling, and heat reuse, ultimately reducing the total cost of ownership, water usage, and power usage effectiveness.
